Терм Pad 80x80 д мощност

Thermal impedance: 0.04 C-cm2/W Phase change temperature: within 45℃ Storage method: refrigerated storage Scope of application: heat transfer of electronic components Method: attached to the surface of the heating or radiator Size:80*80*0.2mm Weight: 10 grams This product is a phase change material. During air transportation, cabin and local climate may cause slight deformation of the edges, which does not affect use. If you cannot accept it, please do not buy. Thoroughly clean the chip surface and the contact surface of the heat sink with complimentary alcohol wipes. Important points) If attaching to a chip surface, cut to chip size or slightly smaller by one edge. Edges must be firmly pinned to peel off easily. If attaching to radiator base, make a circle larger than the chip to aid aiming, and avoid covering uneven protrusions. The film peels easily on flat surfaces. Edges must not hang, to facilitate next steps. Uneven or dangling edges hinder peeling; Tear one side of release film and stick to radiator base or chip surface (do not knead the film before use. If room temp is high, refrigerate ten minutes for easier peeling); Use thumb to press evenly to adhere the film for easy removal later; Tear off the other half of the release film. A easy-tearing aid helps; start from corners for convenience; Install and tighten the radiator, then use immediately. Note: Color may vary due to monitor/light. Allow 1-2 cm measurement difference due to manual measuring. PTM7950 Thermal Interface Material Phase Change 8.5W/mK for CPU Features: Certified Reliability: 1000-hour bake and 1000 thermal cycles ensure low thermal resistance under extreme conditions. High-grade Conductivity: 8.5W/mK for rapid heat transfer, preventing thermal throttling. Slim-profile: 0.2mm thickness for high-density electronics